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About this Engineering article
Improving Low-Ag Pb-Free Solder Performance by Adding Bi, Ni Elements by Sun, Feng Lian; Liu, Yang; Liu, Yang; Wang, Jia Bing; Zhang, Hong Wu is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Sun, Feng Lian; Liu, Yang; Liu, Yang; Wang, Jia Bing; Zhang, Hong Wu
- Publisher
- Trans Tech Publications, Ltd.; Trans Tech Publications (ISSN 1662-8958)
- Published
- 2011
- Language
- EN
- Field
- Engineering (Physical Sciences)
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