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About this scholarly article
2013 14th International Conference on Electronic Packaging Technology - Thermal fatigue reliability design of solder bumps in TSV interposer package based on finite element analysis by Guofeng, Xia; Fei, Qin; Si, Chen; Tong, An is a scholarly article available to read on EtoBox.
- Author
- Guofeng, Xia; Fei, Qin; Si, Chen; Tong, An
- Publisher
- IEEE
- Published
- 2013
- Language
- EN
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