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About this Engineering article
Influence of Voed Geometry on Electromigration Failure in Via-Line Structures by Miner, B.; Sriram, T. S.; Pelillo, A.; Bill, S. A. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Miner, B.; Sriram, T. S.; Pelillo, A.; Bill, S. A.
- Publisher
- Cambridge University Press; Cambridge University Press (Materials Research Society); Cambridge University Press (CUP) (ISSN 0272-9172)
- Published
- 1997
- Language
- EN
- Field
- Engineering (Physical Sciences)
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