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About this Engineering article

Modelling Fatigue Crack Growth near an Open Hole under Spectrum Loading Using a New Method for Elastic-Plastic Stress Calculation by Wallbrink, Chris; Hu, Wei Ping is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Wallbrink, Chris; Hu, Wei Ping
Publisher
Trans Tech Publications, Ltd.; Trans Tech Publications (ISSN 1662-8958)
Published
2011
Field
Engineering (Physical Sciences)

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