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About this Engineering article
Modelling Fatigue Crack Growth near an Open Hole under Spectrum Loading Using a New Method for Elastic-Plastic Stress Calculation by Wallbrink, Chris; Hu, Wei Ping is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Wallbrink, Chris; Hu, Wei Ping
- Publisher
- Trans Tech Publications, Ltd.; Trans Tech Publications (ISSN 1662-8958)
- Published
- 2011
- Field
- Engineering (Physical Sciences)