About this scholarly article

2014 15th International Conference on Electronic Packaging Technology - Packaging and process optimization for three-dimensional structure unit of double-sided cooling IGBT module by Wang, Chunlei; Zheng, Libing; Han, Li; Fang, Huachao; Xu, Ju is a scholarly article available to read on EtoBox.

Author

Wang, Chunlei; Zheng, Libing; Han, Li; Fang, Huachao; Xu, Ju

Publisher

IEEE

Published

2014

Language

EN