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Silicon Wafer Back Grinding Simulations by Anthony Galay is a document available to read on EtoBox.
What is Silicon Wafer Back Grinding Simulations about?
The document summarizes a numerical simulation study of the back grinding process for silicon wafers. The objectives were to develop a simulation tool to help optimize the process for Micron Technologies and understand the effects of process parameters. Finite element models were created in ABAQUS to simulate grinding from different perspectives. The models were verified against experimental and literature data. The document provides an overview of the simulation approaches, wafer grinding models including
- Author
- Anthony Galay
- Language
- EN