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About this Engineering article
Thermo-Mechanical Reliability of 1200V-450A IGBT Module Considering Voids in the Solder Layer by Guo, Xin Hua; Yang, Guang Deng; Fu, Jin Yuan; Huang, Ke is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Guo, Xin Hua; Yang, Guang Deng; Fu, Jin Yuan; Huang, Ke
- Publisher
- Trans Tech Publications, Ltd.; Trans Tech Publications Ltd. (ISSN 1662-9752)
- Published
- 2019
- Field
- Engineering (Physical Sciences)
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