About this scholarly article

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Solder fatigue of Wafer Level package assemblies. Comparison with flip chip BGA’S by Regard, Charles; Gautier, Christian; Fremont, Helene; Val, Alexandre; Roullier, Frederic; Schwindenhammer, Patrice; Poirier, Patrick is a scholarly article available to read on EtoBox.

Author

Regard, Charles; Gautier, Christian; Fremont, Helene; Val, Alexandre; Roullier, Frederic; Schwindenhammer, Patrice; Poirier, Patrick

Publisher

IEEE

Published

2008

Language

EN