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This document provides test methods for simulating the thermal stresses of convection reflow assembly on printed circuit boards. It specifies: 1. The test specimen design criteria, including using standard coupon designs from IPC-2221 with representative plated through holes, vias, ground/power planes. 2. Equipment requirements, including a convection reflow oven capable of following the temperature profiles in Figures 5-1 to 5-3 and a drying oven for conditioning. 3. Test procedures, which include co

Author

Jose Pablo Venegas

Language

EN