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Progress in Electromagnetics Research, Vol. 123, 1-11, 2012 by sathi420 is a document available to read on EtoBox.

What is Progress in Electromagnetics Research, Vol. 123, 1-11, 2012 about?

The document discusses methods for improving the signal integrity of vertical interconnects in high-performance packaging. It addresses techniques like voiding, padless vias, and spiral micro-via stacking. Simulation results demonstrate that these optimized schemes can significantly improve overall package signal integrity performance.

Author

sathi420

Language

EN