About this scholarly article

2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) - Modeling and characterization of carbon-based heterogeneous interconnects for 3-D ICs by Zhao, Wen-Sheng; Liu, Yun-Fan; Yong, Zheng; Fang, Yuan; Yin, Wen-Yan is a scholarly article available to read on EtoBox.

Author

Zhao, Wen-Sheng; Liu, Yun-Fan; Yong, Zheng; Fang, Yuan; Yin, Wen-Yan

Publisher

IEEE

Published

2013

Language

EN