About this scholarly article

2016 International Conference on Electronics Packaging (ICEP) - Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis by Landesberger, C.; Palavesam, N.; Hell, W.; Drost, A.; Faul, R.; Gieser, H.; Bonfert, D.; Bock, K.; Kutter, C. is a scholarly article available to read on EtoBox.

Author

Landesberger, C.; Palavesam, N.; Hell, W.; Drost, A.; Faul, R.; Gieser, H.; Bonfert, D.; Bock, K.; Kutter, C.

Publisher

IEEE

Published

2016

Language

EN