About this scholarly article

SPIE Proceedings [SPIE International Symposium on Microelectronics and Assembly - Singapore, Singapore (Monday 27 November 2000)] Microelectronic Yield, Reliability, and Advanced Packaging - System-level I/O power modeling by Pinello, William P.; Patel, P. R.; Li, Yuang-Liang; Tan, Cher Ming; Peng, Yeng-Kaung; Mahalingam, Mali; Prasad, Krishnamachar is a scholarly article available to read on EtoBox.

Author

Pinello, William P.; Patel, P. R.; Li, Yuang-Liang; Tan, Cher Ming; Peng, Yeng-Kaung; Mahalingam, Mali; Prasad, Krishnamachar

Publisher

SPIE

Published

2000

Language

EN