About this document
Reflow Process Window for My Oven by ADitya Dev is a document available to read on EtoBox.
This document summarizes a reflow oven process window for soldering electronic components. It provides the temperature setpoints for 10 zones of the oven over time. It also evaluates the process for IC, BGA, QFN, and coil components against metrics like maximum rising slope, soak time at 170-180C, peak temperature, and total time above 221C. The process window definitions for these metrics are provided.
- Author
- ADitya Dev
- Language
- EN