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About this Engineering article
A Reliability Study of Barrier-metal-clad Copper Interconnects with Self-aligned Metallic Caps by Saito, T.; Ashihara, H.; Ishikawa, K.; Miyauchi, M.; Yamada, Y.; Nakano, H. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Saito, T.; Ashihara, H.; Ishikawa, K.; Miyauchi, M.; Yamada, Y.; Nakano, H.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0018-9383)
- Published
- 2004
- Language
- EN
- Field
- Engineering (Physical Sciences)
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