About this scholarly article

2011 IEEE/SICE International Symposium on System Integration (SII) - Effects of ESD and EMI on TMR heads during bonding process of gold ball bonding machines by Puapairoj, Sarunya; Sa-ngiamsak, Chiranut is a scholarly article available to read on EtoBox.

Author

Puapairoj, Sarunya; Sa-ngiamsak, Chiranut

Publisher

IEEE

Published

2011

Language

EN