About this scholarly article

2008 International Conference on Electronic Packaging Technology & High Density Packaging - Microstructure and properties of environmental-friendly Sip/1199Al composites used for electronic packaging by Ziyang Xiu, ; Guoqin Chen, ; Zongquan Deng, ; Gaohui Wu, is a scholarly article available to read on EtoBox.

Author

Ziyang Xiu, ; Guoqin Chen, ; Zongquan Deng, ; Gaohui Wu,

Publisher

IEEE

Published

2008