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About this Engineering article
Void Growth Due to Creep and Grain Boundary Diffusion at High Triaxialities by E. Van Der Giessen; M.W.D. Van Der Burg; A. Needleman; V. Tvergaard is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- E. Van Der Giessen; M.W.D. Van Der Burg; A. Needleman; V. Tvergaard
- Publisher
- Elsevier Science; Elsevier ; Elsevier Ltd.; Elsevier BV (ISSN 0022-5096)
- Published
- 1995
- Language
- EN
- Field
- Engineering (Physical Sciences)
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