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About this scholarly article
2017 IEEE International Electron Devices Meeting (IEDM) - 22FFL: A high performance and ultra low power FinFET technology for mobile and RF applications by Sell, B.; Bigwood, B.; Cha, S.; Chen, Z.; Dhage, P.; Fan, P.; Giraud-Carrier, M.; Kar, A.; Karl, E.; Ku, C.-J.; Kumar, R.; Lajoie, T.; Lee, H.-J.; Liu, G.; Liu, S.; Ma, Y.; Mudanai, S.; Nguyen, L.; Paulson, L.; Phoa, K.; Pierce, K.; Roy, A.; Russell, R.; Sandford, J.; Stoeger, J.; Stojanovic, N.; Sultana, A.; Waldemer, J.; Wan, J.; Xu, W.; Young, D.; Zhang, J.; Zhang, Y.; Bai, P. is a scholarly article available to read on EtoBox.
- Author
- Sell, B.; Bigwood, B.; Cha, S.; Chen, Z.; Dhage, P.; Fan, P.; Giraud-Carrier, M.; Kar, A.; Karl, E.; Ku, C.-J.; Kumar, R.; Lajoie, T.; Lee, H.-J.; Liu, G.; Liu, S.; Ma, Y.; Mudanai, S.; Nguyen, L.; Paulson, L.; Phoa, K.; Pierce, K.; Roy, A.; Russell, R.; Sandford, J.; Stoeger, J.; Stojanovic, N.; Sultana, A.; Waldemer, J.; Wan, J.; Xu, W.; Young, D.; Zhang, J.; Zhang, Y.; Bai, P.
- Publisher
- IEEE
- Published
- 2017