About this scholarly article

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor by Auersperg, J.; Auerswald, E.; Collet, C.; Dean, Th.; Vogel, D.; Winkler, Th.; Rzepka, S. is a scholarly article available to read on EtoBox.

Author

Auersperg, J.; Auerswald, E.; Collet, C.; Dean, Th.; Vogel, D.; Winkler, Th.; Rzepka, S.

Publisher

IEEE

Published

2017

Language

EN