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About this Engineering article
Enhanced strength, ductility and electrical conductivity of Cu–Te alloys via dynamic recrystallization and precipitation by Shen, Zhe (author);Lin, Zhongze (author);Shi, Peijian (author);Tang, Ganpei (author);Zheng, Tianxiang (author);Liu, Chunmei (author);Guo, Yifeng (author);Zhong, Yunbo (author) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Shen, Zhe (author);Lin, Zhongze (author);Shi, Peijian (author);Tang, Ganpei (author);Zheng, Tianxiang (author);Liu, Chunmei (author);Guo, Yifeng (author);Zhong, Yunbo (author)
- Publisher
- Elsevier BV
- Published
- 2021
- Field
- Engineering (Physical Sciences)