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About this Engineering article
Effects of process variation in VLSI interconnects – a technical review by Verma, K.G.; Kaushik, B.K.; Singh, R. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Verma, K.G.; Kaushik, B.K.; Singh, R.
- Publisher
- Emerald Group Publishing Limited; Emerald (MCB UP ); Emerald Group Publishing Ltd.; Emerald (ISSN 1356-5362)
- Published
- 2009
- Language
- EN
- Field
- Engineering (Physical Sciences)