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BGA Rework Process: Temperature Control Enhancements by morefast3 is a document available to read on EtoBox.
What is BGA Rework Process: Temperature Control Enhancements about?
The document discusses challenges with the standard practice of using time-dependent profiles for hot air rework of BGA packages. As BGAs decrease in pitch and increase in I/O count, time-dependent profiles provide poor process control. Additionally, embedding thermocouples into BGA balls to develop profiles is difficult. The authors propose a temperature-dependent live-feedback process to improve control and efficiency over the standard practice. Experimental evidence demonstrates the new approach provides
- Author
- morefast3
- Language
- EN