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About this Engineering article
Optimization and Characterization of the Metal Cap Layout Above Through-Silicon Via to Improve Copper Dishing and Protrusion Effect for the Application of 3-D Integrated Circuits by Hu, Luke; Chen, Chun-Hung; Hsu, Steven; Sheng, Y. C.; Lin, M. J.; Lin, C. F.; Yeh, C. T.; Kuo, C. H. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Hu, Luke; Chen, Chun-Hung; Hsu, Steven; Sheng, Y. C.; Lin, M. J.; Lin, C. F.; Yeh, C. T.; Kuo, C. H.
- Publisher
- Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers Inc.; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 2156-3950)
- Published
- 2018
- Language
- EN
- Field
- Engineering (Physical Sciences)