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About this Engineering article
A Three-Dimensional Surface Imaging Method Using THz Dual-Frequency Interferometry by Jiang, Yanwen; Wang, Hongqiang; Qin, Yuliang; Deng, Bin; Gao, Jingkun; Zhuang, Zhaowen is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Jiang, Yanwen; Wang, Hongqiang; Qin, Yuliang; Deng, Bin; Gao, Jingkun; Zhuang, Zhaowen
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1545-598X)
- Published
- 2016
- Field
- Engineering (Physical Sciences)