About this scholarly article

SPIE Proceedings [SPIE Microlithography 2005 - San Jose, CA (Sunday 27 February 2005)] Advances in Resist Technology and Processing XXII - Global planarization of gap-filling process for low-k dual damascene applications by Hsu, Ruei Hung; Sturtevant, John L.; Huang, I. H.; Lin, Ling Chieh; Lin, Benjamin Szu-Min is a scholarly article available to read on EtoBox.

Author

Hsu, Ruei Hung; Sturtevant, John L.; Huang, I. H.; Lin, Ling Chieh; Lin, Benjamin Szu-Min

Publisher

SPIE

Published

2005

Language

EN