About this scholarly article

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Reducing Cu/Sn bonding wafer bow for fabrication of MEMS devices by Siow, Li Yan; Lin, Huamao; Zhang, Qing Xin is a scholarly article available to read on EtoBox.

Author

Siow, Li Yan; Lin, Huamao; Zhang, Qing Xin

Publisher

IEEE

Published

2013

Language

EN