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About this Engineering article
Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32nm and beyond by Fiori, Vincent; Gallois-Garreignot, Sébastien; Jaouen, Hervé; Tavernier, Clément is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Fiori, Vincent; Gallois-Garreignot, Sébastien; Jaouen, Hervé; Tavernier, Clément
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 2013
- Language
- EN
- Field
- Engineering (Physical Sciences)
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