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Electronics Manufacturing : With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials by John H. Lau; C. P. Wong; Ning-Cheng Lee; Ricky S. W. Lee is a book available to read on EtoBox.
What is Electronics Manufacturing : With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials about?
<p>ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS</p> <p>This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field.</p> <p>Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored:</p> <p>* Chip (wafer) level interconnects with lead-free solder bumps</p> <p>* Lead-free solder wafer bump
- Author
- John H. Lau; C. P. Wong; Ning-Cheng Lee; Ricky S. W. Lee
- Publisher
- McGraw-Hill School Education Group
- Published
- 2003
- Language
- EN
- ISBN
- 9780071500876
- Subjects
- Engineering, Mathematics, Technology
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