Opening book details…
About this scholarly article
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Effect of backside scratch direction on the Si die strength by Chae, Seung-Hyun; Zhao, Jie-Hua; Edwards, Darvin R.; Ho, Paul S. is a scholarly article available to read on EtoBox.
- Author
- Chae, Seung-Hyun; Zhao, Jie-Hua; Edwards, Darvin R.; Ho, Paul S.
- Publisher
- IEEE
- Published
- 2010
- Language
- EN
More by Chae, Seung-Hyun; Zhao, Jie-Hua; Edwards, Darvin R.; Ho, Paul S.
Browse all works by Chae, Seung-Hyun; Zhao, Jie-Hua; Edwards, Darvin R.; Ho, Paul S.