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About this scholarly article
International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) - A method for evaluating delamination between epoxy moulding compounds and different plated leadframes by Lam, W.K.; Yeung, T.S.; Teng, A.; Yuen, M.M.F. is a scholarly article available to read on EtoBox.
- Author
- Lam, W.K.; Yeung, T.S.; Teng, A.; Yuen, M.M.F.
- Publisher
- IEEE
- Published
- 2000
- Language
- EN
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