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About this Engineering article
Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integration by Eun-Jung Jang; Jae-Won Kim; Bioh Kim; Thorsten Matthias; Young-Bae Park is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Eun-Jung Jang; Jae-Won Kim; Bioh Kim; Thorsten Matthias; Young-Bae Park
- Publisher
- TechnoPress; Springer-Verlag; Korean Institute of Metals and Materials; Springer Science and Business Media LLC; Society for Mining, Metallurgy and Exploration Inc. (ISSN 1598-9623)
- Published
- 2011
- Language
- EN
- Field
- Engineering (Physical Sciences)
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