About this Engineering article
Microsystem technologies: Foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2003 by Bernard Courtois; Bernd Michel is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Bernard Courtois; Bernd Michel
- Publisher
- Springer-Verlag; Springer Verlag; Springer Science and Business Media LLC (ISSN 0946-7076)
- Published
- 2004
- Field
- Engineering (Physical Sciences)