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About this Engineering article
Highly Uniform Microfluidic Electroless Interconnections for Chip Stacking Applications by Hung, H.T. (author);Ma, Z.D. (author);Shih, P.S. (author);Huang, J.H. (author);Kao, L.Y. (author);Yang, C.Y. (author);Renganathan, Vengudusamy (author);Kao, C.L. (author);Hung, Y.C. (author);Kao, C.R. (author) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Hung, H.T. (author);Ma, Z.D. (author);Shih, P.S. (author);Huang, J.H. (author);Kao, L.Y. (author);Yang, C.Y. (author);Renganathan, Vengudusamy (author);Kao, C.L. (author);Hung, Y.C. (author);Kao, C.R. (author)
- Publisher
- Elsevier BV
- Published
- 2021
- Field
- Engineering (Physical Sciences)