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PES for Reliable Flip-Chip Packaging by necromare is a document available to read on EtoBox.

What is PES for Reliable Flip-Chip Packaging about?

This document describes a new flip-chip packaging method called Printing Encapsulation Systems (PES) that addresses issues with conventional dispensing methods. PES uses a printing process to apply an epoxy underfill resin, allowing for high-volume production and the use of higher viscosity resins not suitable for dispensing. Experimental results show PES achieves more uniform filling without voids compared to dispensing. PES also demonstrates higher reliability in testing and is suitable for high-density c

Author

necromare

Language

EN