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The study investigates the effects of alloying elements (Se, In, Zn, and Al) on the microstructural and thermal properties of Sn-43Bi solder alloys. The incorporation of these elements significantly alters the particle size, melting temperature, and wettability of the base alloy, with In notably reducing the melting temperature from 139 °C to 114 °C. The findings suggest that selective alloying can enhance the mechanical and thermal characteristics of Sn-Bi solder alloys, making them more suitable for elect

Author
Mohammed saleh Nasser Al-Salmi
Language
EN

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