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Atomic layer deposition (ALD) is a thin film deposition technique that allows for atomic-scale control of film thickness by separating the deposition process into self-limiting half-reactions. ALD breaks the deposition process down cycle-by-cycle to expose the substrate to alternating precursor gases to deposit a monolayer of material with each cycle, allowing for highly conformal and uniform coatings. Some key benefits of ALD include atomic-level thickness control, low defect films, and compatibility with

Author

Shahid Ali Leghari

Language

EN