About this scholarly article

2006 1st Electronic Systemintegration Technology Conference - Test Chip for Characterization of Mechanical Stress Caused by Packaging Processes by Hirsch, Soeren; Schmidt, Marc-peter; Schmidt, Bertram is a scholarly article available to read on EtoBox.

Author

Hirsch, Soeren; Schmidt, Marc-peter; Schmidt, Bertram

Publisher

IEEE

Published

2006

Language

EN