About this scholarly article

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Packaging effects on Q factor of MEMS resonator by Kisoo Shin, ; Do-Hwan Park, ; Seungoh Han, is a scholarly article available to read on EtoBox.

Author

Kisoo Shin, ; Do-Hwan Park, ; Seungoh Han,

Publisher

IEEE

Published

2017