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This review paper examines the thermo-mechanical reliability of glass substrates and Through Glass Vias (TGV) in electronic packaging, highlighting the advantages of glass over traditional organic materials, such as improved thermal stability and compatibility with silicon. It discusses challenges including fragility, stress management, and limited long-term reliability data, while exploring fabrication processes and design parameters that influence reliability. The paper emphasizes the need for further res

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juho2302

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EN