About this scholarly article

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - 24"×18" Fan-out panel level packing by Braun, T.; Becker, K.-F.; Voges, S.; Bauer, J.; Kahle, R.; Bader, V.; Thomas, T.; Aschenbrenner, R.; Lang, K.-D. is a scholarly article available to read on EtoBox.

Author

Braun, T.; Becker, K.-F.; Voges, S.; Bauer, J.; Kahle, R.; Bader, V.; Thomas, T.; Aschenbrenner, R.; Lang, K.-D.

Publisher

IEEE

Published

2014

Language

EN