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What is MetalMUMPs Process Overview Guide about?

The MetalMUMPs process uses electroplated nickel as the primary structural material and electrical interconnect layer. Doped polysilicon can be used for resistors, additional mechanical structures, and electrical routing. Silicon nitride is used as an electrical isolation layer, while deposited oxide is used for sacrificial layers. The process involves depositing and patterning various layers including oxide, nitride, polysilicon, and metal using lithography and etching to build MEMS devices that are later

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