About this scholarly article

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Feature Extraction and RUL Prediction of SAC Solder Alloy Packages by Different Statistical and Time-frequency Analysis Techniques under Simultaneous Temperature-Vibration Loads by Lall, Pradeep; Thomas, Tony; Suhling, Jeff is a scholarly article available to read on EtoBox.

Author

Lall, Pradeep; Thomas, Tony; Suhling, Jeff

Publisher

IEEE

Published

2018

Language

EN