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About this scholarly article
SPIE Proceedings [SPIE NDE for Health Monitoring and Diagnostics - San Diego, CA (Sunday 2 March 2003)] Testing, Reliability, and Application of Micro- and Nano-Material Systems - In situ real-time x-ray quality assessment of BGA and uBGA connections during soldering by Scholz, Oliver; Meyendorf, Norbert; Baaklini, George Y.; Eisenbarth, Michael; Hanke, Randolf; Michel, Bernd; Bigl, Thomas; Schmitt, Peter is a scholarly article available to read on EtoBox.
- Author
- Scholz, Oliver; Meyendorf, Norbert; Baaklini, George Y.; Eisenbarth, Michael; Hanke, Randolf; Michel, Bernd; Bigl, Thomas; Schmitt, Peter
- Publisher
- SPIE
- Published
- 2003