About this scholarly article

2012 3rd IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG) - Modelling the clamping force distribution among chips in press-pack IGBTs using the finite element method by Hasmasan, A.; Busca, C.; Teodorescu, R.; Helle, L. is a scholarly article available to read on EtoBox.

Author

Hasmasan, A.; Busca, C.; Teodorescu, R.; Helle, L.

Publisher

IEEE

Published

2012

Language

EN