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About this Engineering article
Finite element analysis of PWB warpage due to cured solder mask-sensitivity analysis by Ume, I.C.; Martin, T. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Ume, I.C.; Martin, T.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1070-9886)
- Published
- 1997
- Field
- Engineering (Physical Sciences)