About this scholarly article

Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004. - Low resistivity copper interconnection layers by Hara, T.; Namiki, K.; Shimura, Y. is a scholarly article available to read on EtoBox.

Author

Hara, T.; Namiki, K.; Shimura, Y.

Publisher

IEEE

Published

2004

Language

EN