About this scholarly article

2006 7th International Conference on Electronic Packaging Technology - Mechanical Properties of Arrayed Pb-Free Tin Bump and Its Interfacial Reaction with Ni-P UBM during Reflow Process by Zhu, Dapeng; Le Luo, is a scholarly article available to read on EtoBox.

Author

Zhu, Dapeng; Le Luo,

Publisher

IEEE

Published

2006