Opening book details…
About this Engineering article
Benchmarking Digital Die-to-Die Channels in 2.5-D and 3-D Heterogeneous Integration Platforms by Zhang, Yang; Zhang, Xuchen; Bakir, Muhannad S. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Zhang, Yang; Zhang, Xuchen; Bakir, Muhannad S.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0018-9383)
- Published
- 2018
- Language
- EN
- Field
- Engineering (Physical Sciences)
More by Zhang, Yang; Zhang, Xuchen; Bakir, Muhannad S.
Browse all works by Zhang, Yang; Zhang, Xuchen; Bakir, Muhannad S.