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About this Engineering article
Nondestructive Infrared Inspection of Hybrid Microcircuit Substrate-to-Package Thermal Adhesive Bonds by Kallis, J.; Egan, G.; Wirick, M. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Kallis, J.; Egan, G.; Wirick, M.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0148-6411)
- Published
- 1981
- Field
- Engineering (Physical Sciences)